KD Market research launches a new
market research report on the Embedded FPGA Market. The
study covers a detailed in-depth analysis of the global market along with the
regional and country level analysis. The study also delivers a complete
analysis about the major & niche players of Embedded FPGA Market which
includes profiling of Intel Corporation,
Qualcomm Technologies Incorporation, Broadcom Limited, Quick Logic Corporation,
NXP Semiconductors N.V., Renesas Electronics Corporation, Analog Devices Inc.,
Xilinx Inc., Microchip Technology, and Cypress Semiconductor.
Embedded FPGA is an IP block that allows a complete FPGA to
be incorporated into any integrated circuit. The solutions implemented in
embedded FPGA are faster and less power consuming, which makes them simpler and
cheaper than FPGA. Embedded FPGA uses a considerable amount of silicon area and
maximum metal layers in a process.
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Factors, such as low power requirement and reduced system
cost drive the demand for embedded FPGA. Moreover, the adoption of eFPGA in
high-end applications is expected to be opportunistic for the market. However,
designing complexities could hamper the market growth.
The global embedded FPGA market is segmented based on
technology, application and region. On the basis of technology, the market is
divided into EEPROM, antifuse, SRAM, flash, and others. By application, the
market is segmented into consumer electronics, automotive, industrial, data
processing, military & aerospace, telecom, and others. Based on region, the
market is analyzed across North America, Europe, Asia-Pacific, and LAMEA.
The key players operating in the embedded FPGA market
include Intel Corporation, Qualcomm Technologies Incorporation, Broadcom
Limited, Quick Logic Corporation, NXP Semiconductors N.V., Renesas Electronics
Corporation, Analog Devices Inc., Xilinx Inc., Microchip Technology, and Cypress
Semiconductor.
KEY BENEFITS
-In-depth analysis and dynamics of the global eFPGA market
are provided in the report to understand the market scenario.
-Quantitative analysis of the current trends and future
estimations from 2018 to 2024 is provided to assist strategists and
stakeholders to capitalize on the prevailing market opportunities.
-Porter?s Five Forces analysis examines the competitive
structure and provides a clear understanding of the factors that influence
market entry and expansion.
-A detailed analysis of the geographical segments assists in
identifying the profitable segments for market players.
-Comprehensive analyses of the trends, subsegments, and key
revenue pockets of the market is included in the study.
KEY MARKET SEGMENTS
By Technology – EEPROM, Antifuse, SRAM, Flash, Others
By Application –Data
processing, Consumer electronics, Industrial, Military & aerospace,
Automotive, Telecom, Others
By Region –
North America, U.S., Canada, Mexico, Europe, UK, Germany, France, Russia, Rest
of Europe, Asia-Pacific, China, India, Japan, Australia, Rest of Asia-Pacific,
LAMEA, Latin America, Middle East, Africa
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Table of Content
CHAPTER 1: INTRODUCTION
1.1. REPORT DESCRIPTION
1.2. KEY BENEFITS FOR STAKEHOLDERS
1.3. RESEARCH METHODOLOGY
1.2. KEY BENEFITS FOR STAKEHOLDERS
1.3. RESEARCH METHODOLOGY
1.3.1. Secondary research
1.3.2. Primary research
1.3.3. Analyst tools & models
1.3.2. Primary research
1.3.3. Analyst tools & models
CHAPTER 2: EXECUTIVE SUMMARY
2.1. CXO PERSPECTIVE
CHAPTER 3: MARKET OVERVIEW
3.1. MARKET DEFINITION AND SCOPE
3.2. KEY FINDINGS
3.2. KEY FINDINGS
3.2.1. Top impacting factors
3.2.2. Top investment pockets
3.2.3. Top Winning Strategies
3.2.2. Top investment pockets
3.2.3. Top Winning Strategies
3.3. PORTER’S FIVE FORCES ANALYSIS
3.4. MARKET SHARE ANALYSIS, 2017
3.5. MARKET DYNAMICS
3.4. MARKET SHARE ANALYSIS, 2017
3.5. MARKET DYNAMICS
3.5.1. Drivers
3.5.1.1. Low power requirement
3.5.1.2. Reduced system cost
3.5.1.2. Reduced system cost
3.5.2. Restraint
3.5.2.1. Designing complexities
3.5.3. Opportunities
3.5.3.1. Adoption in high-end applications
CHAPTER 4: EMBEDDED FPGA MARKET, BY TECHNOLOGY
4.1. OVERVIEW
4.2. EEPROM
4.2. EEPROM
4.2.1. Key market trends and opportunities
4.2.2. Market size and forecast, by region
4.2.3. Market analysis by country
4.2.2. Market size and forecast, by region
4.2.3. Market analysis by country
4.3. ANTIFUSE
4.3.1. Key market trends and opportunities
4.3.2. Market size and forecast, by region
4.3.3. Market analysis by country
4.3.2. Market size and forecast, by region
4.3.3. Market analysis by country
4.4. SRAM
4.4.1. Key market trends and opportunities
4.4.2. Market size and forecast, by region
4.4.3. Market analysis by country
4.4.2. Market size and forecast, by region
4.4.3. Market analysis by country
4.5. FLASH
4.5.1. Key market trends and opportunities
4.5.2. Market size and forecast, by region
4.5.3. Market analysis by country
4.5.2. Market size and forecast, by region
4.5.3. Market analysis by country
4.6. OTHERS
4.6.1. Key market trends and opportunities
4.6.2. Market size and forecast, by region
4.6.3. Market analysis by country
4.6.2. Market size and forecast, by region
4.6.3. Market analysis by country
CHAPTER 5: GLOBAL EMBEDDED FPGA MARKET, BY APPLICATION
5.1. OVERVIEW
5.2. DATA PROCESSING
5.2. DATA PROCESSING
5.2.1. Key market trends and opportunities
5.2.2. Market size and forecast, by region
5.2.3. Market analysis by country
5.2.2. Market size and forecast, by region
5.2.3. Market analysis by country
5.3. CONSUMER ELECTRONICS
5.3.1. Key market trends and opportunities
5.3.2. Market size and forecast, by region
5.3.3. Market analysis by country
5.3.2. Market size and forecast, by region
5.3.3. Market analysis by country
5.4. INDUSTRIAL
5.4.1. Key market trends and opportunities
5.4.2. Market size and forecast, by region
5.4.3. Market analysis by country
5.4.2. Market size and forecast, by region
5.4.3. Market analysis by country
5.5. MILITARY & AEROSPACE
5.5.1. Key market trends and opportunities
5.5.2. Market size and forecast, by region
5.5.3. Market analysis by country
5.5.2. Market size and forecast, by region
5.5.3. Market analysis by country
5.6. AUTOMOTIVE
5.6.1. Key market trends and opportunities
5.6.2. Market size and forecast, by region
5.6.3. Market analysis by country
5.6.2. Market size and forecast, by region
5.6.3. Market analysis by country
5.7. TELECOM
5.7.1. Key market trends and opportunities
5.7.2. Market size and forecast, by region
5.7.3. Market analysis by country
5.7.2. Market size and forecast, by region
5.7.3. Market analysis by country
5.8. OTHERS
5.8.1. Key market trends and opportunities
5.8.2. Market size and forecast, by region
5.8.3. Market analysis by country
5.8.2. Market size and forecast, by region
5.8.3. Market analysis by country
CHAPTER 6: GLOBAL EMBEDDED FPGA MARKET, BY REGION
6.1. OVERVIEW
6.2. NORTH AMERICA
6.2. NORTH AMERICA
6.2.1. Key market trends and opportunities
6.2.2. Market size and forecast, by technology
6.2.3. Market size and forecast, by application
6.2.4. Market analysis by country
6.2.2. Market size and forecast, by technology
6.2.3. Market size and forecast, by application
6.2.4. Market analysis by country
6.2.4.1. U.S.
6.2.4.1.1. Market size and forecast, by technology
6.2.4.1.2. Market size and forecast, by application
6.2.4.1.2. Market size and forecast, by application
6.2.4.2. Canada
6.2.4.2.1. Market size and forecast, by technology
6.2.4.2.2. Market size and forecast, by application
6.2.4.2.2. Market size and forecast, by application
6.2.4.3. Mexico
6.2.4.3.1. Market size and forecast, by technology
6.2.4.3.2. Market size and forecast, by application
6.2.4.3.2. Market size and forecast, by application
6.3. EUROPE
6.3.1. Key market trends and growth factors &
opportunities
6.3.2. Market size and forecast, by technology
6.3.3. Market size and forecast, by application
6.3.4. Market size and forecast, by country
6.3.2. Market size and forecast, by technology
6.3.3. Market size and forecast, by application
6.3.4. Market size and forecast, by country
6.3.4.1. UK
6.3.4.1.1. Market size and forecast, by technology
6.3.4.1.2. Market size and forecast, by application
6.3.4.1.2. Market size and forecast, by application
6.3.4.2. Germany
6.3.4.2.1. Market size and forecast, by technology
6.3.4.2.2. Market size and forecast, by application
6.3.4.2.2. Market size and forecast, by application
6.3.4.3. France
6.3.4.3.1. Market size and forecast, by technology
6.3.4.3.2. Market size and forecast, by application
6.3.4.3.2. Market size and forecast, by application
6.3.4.4. Rest of Europe
6.3.4.4.1. Market size and forecast, by technology
6.3.4.4.2. Market size and forecast, by application
6.3.4.4.2. Market size and forecast, by application
6.4. ASIA-PACIFIC
6.4.1. Key market trends and opportunities
6.4.2. Market size and forecast, by technology
6.4.3. Market size and forecast, by application
6.4.4. Market analysis by country
6.4.2. Market size and forecast, by technology
6.4.3. Market size and forecast, by application
6.4.4. Market analysis by country
6.4.4.1. China
6.4.4.1.1. Market size and forecast, by technology
6.4.4.1.2. Market size and forecast, by application
6.4.4.1.2. Market size and forecast, by application
6.4.4.2. India
6.4.4.2.1. Market size and forecast, by technology
6.4.4.2.2. Market size and forecast, by application
6.4.4.2.2. Market size and forecast, by application
6.4.4.3. Japan
6.4.4.3.1. Market size and forecast, by technology
6.4.4.3.2. Market size and forecast, by application
6.4.4.3.2. Market size and forecast, by application
6.4.4.4. Rest of Asia-Pacific
6.4.4.4.1. Market size and forecast, by technology
6.4.4.4.2. Market size and forecast, by application
6.4.4.4.2. Market size and forecast, by application
6.5. LAMEA
6.5.1. Key market trends and key growth factors &
opportunities
6.5.2. Market size and forecast, by technology
6.5.3. Market size and forecast, by application
6.5.4. Market analysis by sub-region
6.5.2. Market size and forecast, by technology
6.5.3. Market size and forecast, by application
6.5.4. Market analysis by sub-region
6.5.4.1. Latin America
6.5.4.1.1. Market size and forecast, by technology
6.5.4.1.2. Market size and forecast, by application
6.5.4.1.2. Market size and forecast, by application
6.5.4.2. Middle East
6.5.4.2.1. Market size and forecast, by technology
6.5.4.2.2. Market size and forecast, by application
6.5.4.2.2. Market size and forecast, by application
6.5.4.3. Africa
6.5.4.3.1. Market size and forecast, by technology
6.5.4.3.2. Market size and forecast, by application
6.5.4.3.2. Market size and forecast, by application
CHAPTER 7: COMPANY PROFILES
7.1. INTEL CORPORATION
7.1.1. Company overview
7.1.2. Company snapshot
7.1.3. Operating business segments
7.1.4. Product portfolio
7.1.5. Business performance
7.1.6. Key strategic moves and developments
7.1.2. Company snapshot
7.1.3. Operating business segments
7.1.4. Product portfolio
7.1.5. Business performance
7.1.6. Key strategic moves and developments
7.2. QUALCOMM TECHNOLOGIES
7.2.1. Company overview
7.2.2. Company snapshot
7.2.3. Operating business segments
7.2.4. Product portfolio
7.2.5. Business performance
7.2.6. Key strategic moves and developments
7.2.2. Company snapshot
7.2.3. Operating business segments
7.2.4. Product portfolio
7.2.5. Business performance
7.2.6. Key strategic moves and developments
7.3. XILINX CORPORATION
7.3.1. Company overview
7.3.2. Company snapshot
7.3.3. Operating business segments
7.3.4. Product portfolio
7.3.5. Business performance
7.3.6. Key strategic moves and developments
7.3.2. Company snapshot
7.3.3. Operating business segments
7.3.4. Product portfolio
7.3.5. Business performance
7.3.6. Key strategic moves and developments
7.4. QUICK LOGIC CORPORATION
7.4.1. Company overview
7.4.2. Company snapshot
7.4.3. Operating business segments
7.4.4. Product portfolio
7.4.5. Business performance
7.4.6. Key strategic moves and developments
7.4.2. Company snapshot
7.4.3. Operating business segments
7.4.4. Product portfolio
7.4.5. Business performance
7.4.6. Key strategic moves and developments
7.5. NXP SEMICONDUCTORS
7.5.1. Company overview
7.5.2. Company snapshot
7.5.3. Operating business segments
7.5.4. Product portfolio
7.5.5. Business performance
7.5.6. Key strategic moves and developments
7.5.2. Company snapshot
7.5.3. Operating business segments
7.5.4. Product portfolio
7.5.5. Business performance
7.5.6. Key strategic moves and developments
7.6. RENESAS ELECTRONICS CORPORATION
7.6.1. Company overview
7.6.2. Company snapshot
7.6.3. Operating business segments
7.6.4. Product portfolio
7.6.5. Business performance
7.6.6. Key strategic moves and developments
7.6.2. Company snapshot
7.6.3. Operating business segments
7.6.4. Product portfolio
7.6.5. Business performance
7.6.6. Key strategic moves and developments
7.7. MICROCHIP TECHNOLOGY
7.7.1. Company overview
7.7.2. Company snapshot
7.7.3. Operating business segments
7.7.4. Product portfolio
7.7.5. Business performance
7.7.6. Key strategic moves and developments
7.7.2. Company snapshot
7.7.3. Operating business segments
7.7.4. Product portfolio
7.7.5. Business performance
7.7.6. Key strategic moves and developments
7.8. CYPRESS SEMICONDUCTOR
7.8.1. Company overview
7.8.2. Company snapshot
7.8.3. Operating business segments
7.8.4. Product portfolio
7.8.5. Business performance
7.8.6. Key strategic moves and developments
7.8.2. Company snapshot
7.8.3. Operating business segments
7.8.4. Product portfolio
7.8.5. Business performance
7.8.6. Key strategic moves and developments
7.9. BROADCOM LIMITED
7.9.1. Company overview
7.9.2. Company snapshot
7.9.3. Operating business segments
7.9.4. Product portfolio
7.9.5. Business performance
7.9.6. Key strategic moves and developments
7.9.2. Company snapshot
7.9.3. Operating business segments
7.9.4. Product portfolio
7.9.5. Business performance
7.9.6. Key strategic moves and developments
7.10. ANALOG DEVICES INC.
7.10.1. Company overview
7.10.2. Company snapshot
7.10.3. Operating business segments
7.10.4. Product portfolio
7.10.5. Business performance
7.10.6. Key strategic moves and developments
7.10.2. Company snapshot
7.10.3. Operating business segments
7.10.4. Product portfolio
7.10.5. Business performance
7.10.6. Key strategic moves and developments
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